Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1580568 | Materials Science and Engineering: A | 2010 | 9 Pages |
Abstract
The stored energy and thermal stability of micro-extruded ultrafine-grained copper were compared to micro-extruded coarse-grained copper. Each starting material was micro-extruded at room temperature at different speeds to a strain of 2.77 and then studied by differential scanning calorimetry, X-ray diffraction, nano-indentation and electron backscattered diffraction. The stored energy of the ultrafine-grained copper decreased with extrusion speed from a value of 0.95 ± 0.05 J/g for the starting material to 0.71 ± 0.03 J/g for material extruded at 25 mm/min. The peak temperature decreased from 202 °C for material extruded at 0.1 mm/min to 177 °C for material extruded at 25 mm/min. Stored energy and peak temperature values for the conventional copper were approximately constant with extrusion speed at around 0.75 ± 0.03 J/g and 230 °C. The lower stored energy and lower peak temperature of the ultrafine-grained copper compared to conventional copper are attributed to recrystallization commencing during micro-extrusion.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
C.F. Gu, C.H.J. Davies,