Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1581448 | Materials Science and Engineering: A | 2008 | 10 Pages |
Abstract
The effect of adhesion and friction of a rubber mold on powder compacts was studied during unloading under cold isostatic pressing. The densification model by Lee and Kim was used for compaction of powder, based on the yield function of the Cap model and volumetric strain evolution. The bilinear cohesive model was used to study a detaching process and stress distributions at the interface between the mold and the compact. We also studied the failure of the powder compact during unloading under cold isostatic pressing due to friction at the interface, and compared experimental data with finite element results.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
S.C. Lee, K.T. Kim,