Article ID Journal Published Year Pages File Type
1582942 Materials Science and Engineering: A 2008 6 Pages PDF
Abstract

Tensile behavior of an electrodeposited Cu with ultrafine grain size of ∼200 nm was studied at different strain rates and room temperature. By increasing the strain rate the elongation to fracture increased noticeably. Analysis on the deformed and fracture surfaces suggested a shear localization process in the necking stage, which led to a different tendency of cracking. Strong strain rate dependences of work hardening and shear localization might be responsible for variation of the tensile ductility.

Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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