Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1582942 | Materials Science and Engineering: A | 2008 | 6 Pages |
Abstract
Tensile behavior of an electrodeposited Cu with ultrafine grain size of ∼200 nm was studied at different strain rates and room temperature. By increasing the strain rate the elongation to fracture increased noticeably. Analysis on the deformed and fracture surfaces suggested a shear localization process in the necking stage, which led to a different tendency of cracking. Strong strain rate dependences of work hardening and shear localization might be responsible for variation of the tensile ductility.
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Authors
Hanzhuo Zhang, Zhonghao Jiang, Jianshe Lian, Qing Jiang,