| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1584363 | Materials Science and Engineering: A | 2007 | 8 Pages |
Abstract
The agglomeration of nanoparticles during electrocodeposition of nanocomposite thin films is an unresolved issue. In this paper, the effects of ultrasonic irradiation on agglomeration during electrocodeposition of Cu–Al2O3 and Cu–CeO2 nanocomposite thin films on a silicon substrate are investigated. In addition, the effect of electrolyte concentration on agglomeration of nanoparticles is investigated. Irradiation by ultrasound during electrocodeposition yields smaller grain size, improved surface conditions, decreased agglomeration and higher volume fraction of nanosized inert particles within the nanocomposite thin films.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Dongyun Lee, Yong X. Gan, Xi Chen, Jeffrey W. Kysar,