| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1584471 | Materials Science and Engineering: A | 2007 | 5 Pages |
Abstract
Interface adhesion strength of Cu/Cr/polyimide was measured and the effects of annealing atmosphere were investigated. Adhesion strength decreased after annealing in vacuum by 25% and in air by 41%, which was attributed, respectively, to broken carbonyl bonds and to the formation of Cr oxide. Failure mode changed accordingly from cohesive to interfacial at a Cr/polyimide interface.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
T. Miyamura, J. Koike,