| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1584801 | Materials Science and Engineering: A | 2006 | 5 Pages |
Abstract
We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au–20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Jin-Woo Park, Young-Bok Yoon, Sang-Hyun Shin, Sang-Hyun Choi,