Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1586033 | Materials Science and Engineering: A | 2006 | 5 Pages |
Abstract
A highly textured Al/Ti films were deposited on 128° Y–X LiNbO3 substrates by ion beam assisted deposition. Influence of low energy Ar ion beam bombardment on the residual stress and resistivity of the Al/Ti films was investigated. It was found that the residual stress of the Al/Ti films varied from tensile to compressive with increases in ion energy or flux. The films fabricated at 0.5 keV and 3 μA/cm2 possessed zero residual stress. An increase in the compressive stress resulted in a decrease in resistivity. By controlling the ion incident energy and flux, we were able to control the film stress and resistivity that were related to the reliability of SAW devices.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
D.M. Li, X.B. Wang, F. Pan,