| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1586511 | Metal Finishing | 2012 | 5 Pages |
Abstract
In this work, the factors which affect the plating speed of electroless nickel in alkaline were investigated. It indicated that the components in the solution have influence on the plating speed. As nickel chloride (NiCl2) and reductant increases, the plating speed improves manifestly. The microstructures of electroless nickel-boron films were relevant to the plating speed. By controlling the plating speed with adjusting the dose of main salt, complexing agent and reductant, both the crystalline and amorphous films were prepared.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Xin Cheng, Qunli Rao, Hongzhen Yang,