Deep sub micrometer imaging of defects in copper pillars by X-ray tomography in a SEM

The potential of X-ray nanotomography hosted in a SEM in presented in this paper. In order to improve the detail detectability of this system, which is directly related to the X-ray source size, thin metal layers have been studied and installed in the equipment. A 3D resolution pattern has been created in order to determine the smallest detectable features by this setup. This sample is a 25 μm diameter copper pillar in which size-controlled holes have been milled using a plasma-focused ion beam. This pattern has then been scanned and the resulting 3D reconstruction demonstrates that the instrument is able to detect 500 nm diameter voids in a copper interconnection, as used in 3D integration.