Article ID Journal Published Year Pages File Type
1589546 Micron 2009 5 Pages PDF
Abstract

The strain field in the channel of a p-type metal-oxide-semiconductor field effect transistor fabricated by integrating Ge pre-amorphization implantation for source/drain regions is evaluated using a finite-element method combining with large angle convergent-beam electron diffraction (LACBED). The finite-element calculation shows that there is a very large compressive strain in the top layer of the channel region caused by a low dose of Ge ion implantation in the source and drain extension regions. Moreover, a transition region is formed in the bottom of the channel region and the top of the Si substrate. These calculation results are in good agreement with the LACBED experiments.

Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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