Probing inhomogeneities in nanoscale organic semiconductor films: Depth profiling using slow positron beam and X-ray reflectivity techniques

•Defect and electron density profiling using slow positron beam and XRR, respectively in OSC films.•Effect of post deposition annealing on the nanostructure of OSC thin films.•Presence of sub surface nano-level inhomogeneity represented by a region with more defects.•Sensitivity and depth resolution of PAS and XRR for nanostructure characterization in OSC films.

Depth profiling studies in 200 nm organic semiconductor (OSC) films on quartz substrate have been carried out using slow positron beam and X-ray reflectivity (XRR) techniques with the objective of examining structural inhomogeneities in as-deposited film and those annealed at high temperature. Grazing incidence X-ray diffraction and atomic force microscopy measurements are carried out to examine the crystallinity and surface morphology, respectively. In general, annealing is seen to modify the morphology and nanostructure. However, a significant inhomogeneity in nanostructure, marked by a disordered layer with low density region is observed in the film annealed at 200 °C from positron as well as XRR measurements. This study highlights the sensitivity of these techniques to defects and inhomogeneities in nanoscale that may have profound influence on device performance.