Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1593220 | Solid State Communications | 2011 | 5 Pages |
In this paper, we use first-principles calculations to study the correlation between mechanical behaviors and electronic structures of Al–Cu intermetallic compounds. We find that in general, the ductility of intermetallic compounds decreases with the increase in Cu content, while the corresponding work function increases but densities of states decrease. Moreover, homogeneous and symmetrical or small anisotropic charge distributions correspond to small brittleness. The present study therefore suggests that the primary origin of brittleness in intermetallic compounds can be well related to their electronic structures.
► Ductility of Al–Cu intermetallics decreases with Cu content. ► Work function increases with Cu content. ► Homogeneous charge distributions correspond to small brittleness.