| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1600354 | Intermetallics | 2012 | 7 Pages |
Abstract
⺠The thermomechanical property improved for the composite solders. ⺠The addition of Ni-CNTs suppresses the growth of Cu-Ni-Sn IMC layer. âºÂ The composite solder joints had better ultimate shear strength.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei,