Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1600430 | Intermetallics | 2012 | 8 Pages |
Abstract
⺠To prepare the nano metallic particles doped Sn-Ag-Cu composite solders. ⺠To investigate the morphology of IMC of composite solders and OSP-Cu pad. ⺠Kinetic analysis of IMC layers of composite solders and OSP-Cu pad. ⺠To measure the hardness of Sn-Ag-Cu-0.5Ni and Sn-Ag-Cu-0.5Al composite solders.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Asit Kumar Gain, Y.C. Chan,