| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1600468 | Intermetallics | 2012 | 7 Pages |
Abstract
⺠The Ni/solder/Cu-Zn joint shows the remarkable thermal stability during aging. ⺠All interfacial intermetallic compounds are suppressed in the Ni/solder/Cu-Zn. ⺠Voids are inhibited at the Ni/solder/Cu-Zn interfaces. ⺠The cross-interaction between Ni and Cu-Zn is retarded. ⺠The mechanisms for the suppression of intermetallic compounds are proposed.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Chi-Yang Yu, Wei-Yu Chen, Jenq-Gong Duh,