| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1600608 | Intermetallics | 2012 | 5 Pages |
The mechanical properties of new lead-free Sn–Ag–Cu solder alloys containing 0.05–0.1 wt.% boron were investigated under a range of isothermal aging and reflow conditions. The boron-doped solder joints showed higher ball pull strength than the baseline Sn-1.0Ag-0.5Cu solder joint under all isothermal aging and reflow conditions examined. In particular, the high-speed ball pull strength of the 0.05 wt.% B-doped solder joint was approximately 2.5 times greater than that of the baseline Sn-1.0Ag-0.5Cu solder joint aged at 150 °C for 200 h, which is attributed mainly to the reduced rate of grain growth in the intermetallic compound (IMC) layers of B-doped solder joints under aging conditions.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► B-doped lead-free solder is a potential solution under harsh environments. ► Trace amount of B ranging from 0.05 to 0.1 wt.% is added. ► B-doped solder joints show good strength under thermal conditions. ► B addition causes grain size refinement in IMC layers.
