| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1601056 | Intermetallics | 2010 | 5 Pages |
Abstract
Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Kazuhiro Nogita,