Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1601715 | Intermetallics | 2007 | 5 Pages |
Abstract
Electrical resistance measurements at temperatures ranging from 4.2 to 300 K and pressures ranging from 0 to 3.6 GPa indicate that pressurization reduces the energy gap Eg with a pressure coefficient, ⅆEg/ⅆP, of −8.8(4) meV/GPa. The deformation potential of Eg is estimated to be 0.50(2) eV, which is smaller than that of tetrahedrally bonded semiconductors, such as Si (1.46 eV). The reduction of Eg by pressurization is qualitatively consistent with the results of a previously reported calculation [Imai Y, Watanabe A. Intermetallics 2006;14:666].
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Motoharu Imai, Takashi Naka, Hideki Abe, Takao Furubayashi,