Effect of the microstructure of Al 7050-T7451 on anodic oxide formation in sulfuric acid

The effect of the microstructure of an Al 7050-T7451 substrate on the anodic oxide formation in sulfuric acid was studied in this article. The microstructure of the substrate was assessed by optical microscope (OM) and transmission electron microscope (TEM). The surface and cross-section morphologies of the oxide films were examined by scanning electron microscope (SEM). The chemical composition of intermetallic particles in the alloys and films was investigated using energy dispersive spectroscope (EDS). The roles of intermetallic phases and grain or subgrain boundaries on the oxide film formation were researched using the potentio-dynamic and potentiostatic polarization technique in sulfuric acid solution. The results show that the transition of coarse intermetallic particles or grain (subgrain) boundaries at the surface of Al alloys can be characterized by potentiodynamic polarization curves. The surface and cross-section micrographs of the anodic layer seem to preserve the microstructure of the substrate. Large cavities in the anodic films are caused by the preferential dissolution of coarse Al2CuMg particles and the entrance of Cu-rich remnants into the electrolyte during anodizing. The Al7Cu2Fe particles tend to be occluded in the oxide layer or lose from the oxide surface because of peripheral trenching. Small pores in the films are induced by the dissolution of precipitates in grain or subgrain boundaries. The film surface of recrystallized grain bodies is smooth and homogeneous.