Evaluation of microstructure and contiguity of W/Cu composites prepared by coated tungsten powders

In this paper, infiltration behavior of W/Cu composite compacts made from coated tungsten powder has been investigated. For this purpose, tungsten particles were coated with Ni, Ni–P and Ni–Cu–P using electroless plating technique. Then the coated tungsten powders were compacted under selective pressures for control infiltrated copper in range 10–20 wt%. Infiltration process was carried out at 1300 °C under a reducing atmosphere. The effect of pre-coat of tungsten particles on microstructure, contiguity and density of infiltrated W/Cu compacts was evaluated by OM/SEM, EDS and Archimedes methods.It was found that electroless plating of tungsten particles leads to more homogeneity microstructure so relative density of 99.3% was achieved for infiltrated compacts. The contiguity of W–W particles in the microstructure of composite made from Ni–Cu–P coated tungsten powder was lower than to other ones.