| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1607575 | Journal of Alloys and Compounds | 2015 | 9 Pages |
Abstract
The addition of small amounts of Zn into Sn-2.0Ag-0.7Cu solder leads to formation of new types of flower-like or coarse dendrite γ-(Cu, Ag)5Zn8 intermetallic compounds, which controls the overall properties. The optimum percentage of Zn to enhance the inclusive properties was 1.5% Zn.289
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
A.A. El-Daly, H. El-Hosainy, T.A. Elmosalami, W.M. Desoky,