| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1608143 | Journal of Alloys and Compounds | 2015 | 10 Pages |
Abstract
The minor Al additions refined eutectic Cu6Sn5 IMC networks on the Sn-0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition.355
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Jahyun Koo, Changsoo Lee, Sung Jea Hong, Keun-Soo Kim, Hyuck Mo Lee,