Effect of directional solidification rate on the microstructure and properties of deformation-processed Cu-7Cr-0.1Ag in situ composites

The influence of directional solidification rate on the microstructure, mechanical properties and conductivity of deformation-processed Cu-7Cr-0.1Ag in situ composites produced by thermo-mechanical processing was systematically investigated. The microstructure was analyzed by optical microscopy and scanning electronic microscopy. The mechanical properties and conductivity were evaluated by tensile-testing machine and micro-ohmmeter, respectively. The results indicate that the size, shape and distribution of second-phase Cr grains are significantly different in the Cu-7Cr-0.1Ag alloys with different growth rates. At a growth rate of 200 μm s−1, the Cr grains transform into fine Cr fiber-like grains parallel to the pulling direction from the Cr dendrites. The tensile strength of the Cu-7Cr-0.1Ag in situ composites from the directional solidification (DS) alloys is significantly higher than that from the as-cast alloy, while the conductivity of the in situ composites from the DS alloys is slightly lower than that from the as-cast alloy. The following combinations of tensile strength, elongation to fracture and conductivity of the Cu-7Cr-0.1Ag in situ composites from the DS alloy with a growth rate of 200 μm s−1 and a cumulative cold deformation strain of 8 after isochronic aging treatment for 1 h can be obtained respectively as: (i) 1067 MPa, 2.9% and 74.9% IACS; or (ii) 1018 MPa, 3.0%, and 76.0% IACS or (iii) 906 MPa, 3.3% and 77.6% IACS.