Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1610976 | Journal of Alloys and Compounds | 2014 | 6 Pages |
Abstract
The solid-state reactions under confined space between Cu substrate and Sn and Sn-Ag solders are systematically investigated, with the objective of providing fundamental data that are critical to the design of robust microjoints for chip-stacking applications. Sandwich structures of Cu/Sn/Cu and Cu/Sn3.5Ag/Cu are prepared by thermal compression bonding. The thickness of Sn and Sn3.5Ag layer is controlled at 10 μm. High temperature storage tests are conducted at 120 °C, 150 °C, 180 °C, and 200 °C for different time periods. Unlike the well-known void formation in the Ni/Sn/Ni system, there is no such void at all in the Cu/Sn/Cu system. The addition of Ag consistently slows down the growth kinetics of intermetallics. The time-to-impingement of intermetallics is established for the first time for both systems under solid-state reactions.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
T.L. Yang, J.J. Yu, W.L. Shih, C.H. Hsueh, C.R. Kao,