Article ID Journal Published Year Pages File Type
1611554 Journal of Alloys and Compounds 2014 7 Pages PDF
Abstract
A granular Cu80Co20 alloy was elaborated by a low cost electrodeposition technique consisting in reducing simultaneously the Cu2+ and Co2+ ions onto a silicon substrate. The deposition parameters were determined from current-potential curves. The structure of the film was characterized down to the atomic scale by transmission electron microscopy and atom probe tomography. The results show that the as-deposited Cu80Co20 thin film consists mainly of a paramagnetic Cu-Co solid solution containing 10-30% of Co, in which pure Co superparamagnetic nanoparticles are dissolved. Annealing at 500 °C for 1 h leads to the decomposition of the Cu-Co solid solution into purified Cu matrix containing ferromagnetic Co-rich precipitates. The magnetoresistance effect decreases after the heat treatment, in relation with the disappearance of the superparamagnetic Co nanoparticles upon annealing.
Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
Authors
, , , , , , ,