| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1612566 | Journal of Alloys and Compounds | 2014 | 5 Pages |
Abstract
⺠This study first time uses amorphous Fe-Co-B-Ti-Nb to alloy Cu film as an interconnect materials. ⺠Barrierless 0.793 ((Fe0.55Co0.45) 90B6Ti2Nb2)0.207/Si alloy film had the lowest resistivity of 2.7 μΩcm. ⺠TheCu0.699((Fe0.55Co0.45)90B6Ti2Nb2)0.301/Si film is suitable for use in the next generation integrated circuits manufacturing.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Jau-Shiung Fang, Li-Chung Yang, Yi-Chun Lee,