| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1612859 | Journal of Alloys and Compounds | 2013 | 4 Pages |
Abstract
The electromigration behaviors of line-type Cu/Sn-Ag-Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni)6Sn5 intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Zhongbao Yang, Wei Zhou, Ping Wu,