| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1614323 | Journal of Alloys and Compounds | 2013 | 8 Pages |
Abstract
⺠Pd element in ENEPIG surface finishes retarded IMC. ⺠Ce element retarded Sn diffuse from solder matrix to the interface. ⺠Greater shear forces were measured with higher shear speed. ⺠More ductile fracture area was found with Ce content solder. ⺠Increasing in Pd thickness or Ce concentration did not affect to shear strength.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Q.V. Bui, S.B. Jung,