Article ID Journal Published Year Pages File Type
1615354 Journal of Alloys and Compounds 2012 5 Pages PDF
Abstract

Pure Zn is one of the best die-attachment candidates for use in next-generation wide-gap semiconductor power devices operating at temperatures up to 300 °C. However, it has certain drawbacks when used at high operating temperatures: poor ductility and limited oxidation resistance. In this study, we investigated the effect of adding minor elements – Ca, Mn, Cr, and Ti – in improving Zn ductility and oxidation resistance. This addition significantly reduced the grain size of the microstructure, thus improving the tensile strength and elongation of pure Zn. In addition, the minor elements addition significantly improved oxidation resistance of pure Zn. Consequently, because of higher ductility and oxidation resistance, the interconnection ability of Zn alloys as die-attachment candidates was significantly enhanced.

► We enhanced the characteristics of pure Zn as die-attach material. ► The new die-attach materials were made by addition of minor elements in pure Zn. ► We selected Ca, Mn, Cr, and Ti as minor elements. ► The mechanical properties of pure Zn were enhanced by the minor elements addition. ► In addition, the minor elements addition improved oxidation resistance.

Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
Authors
, , , ,