| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1615362 | Journal of Alloys and Compounds | 2012 | 13 Pages |
Abstract
⺠A DFT study of Cu-In and Cu-Sn compounds in Cu-In-Sn soldering alloys is reported. ⺠Structural, cohesive, electronic and thermodynamic trends are established. ⺠Phase-stabilities at low T are well reproduced by the 0 K thermodynamic values. ⺠Available structural and equation-of-state data are satisfactorily accounted for. ⺠Experimental and CALPHAD-based relative-stability properties are well reproduced.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
S. Ramos de Debiaggi, C. Deluque Toro, G.F. Cabeza, A. Fernández Guillermet,