| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1615409 | Journal of Alloys and Compounds | 2012 | 8 Pages |
Abstract
⺠The IMC microstructure and growth were studied under thermal aging conditions. ⺠The Young's modulus and hardness were determined for CuSn and CuNiSn IMC. ⺠Simulation results show that the thick IMC layer results in a lower fatigue life. ⺠The IMC layer with higher modulus results in a lower solder joint fatigue life.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
F.X. Che, John H.L. Pang,