| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1615956 | Journal of Alloys and Compounds | 2012 | 4 Pages |
Abstract
⺠Ti/Al multilayers are promising interlayers for getting joins between titanium aluminides. ⺠When Ti/Al multilayers are doped with Ag or Cu it is observed a higher reactivity of the multilayers. ⺠A doped Ti/Al multilayer decreases the temperature of the process and the quality of the bonding increases.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
L.I. Duarte, F. Viana, A.S. Ramos, M.T. Vieira, C. Leinenbach, U.E. Klotz, M.F. Vieira,