| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1616658 | Journal of Alloys and Compounds | 2012 | 8 Pages |
Abstract
⺠Interface reaction mechanism, experienced thermal cycling and isothermal aging, was carried out. ⺠The growth kinetics which forming intermetallic compounds in both systems were also investigated under different aging conditions. ⺠We found that the morphology of IMCs formed both at the solder/Cu interfaces was gradually changed from scallop-like to planar-like. ⺠We found that rare earth Ce can refine the microstructures, decrease the thickness of the intermetallic compound layer.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Liang Zhang, Song Bai Xue, Guang Zeng, Li Li Gao, Huan Ye,