| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1618325 | Journal of Alloys and Compounds | 2011 | 6 Pages |
Abstract
ⶠIn the electronics industry, the solder alloys commonly used for assembly belong to the Sn-Pb system. Fulfilment of the EU RoHS (reduction of hazardous substances) requires the development of new lead-free alloys for applications in electronics, with the same or possibly better characteristics than the traditional Sn-Pb alloys. ⶠThis research concerns the investigation of the constitutional properties of the Cu-Sn-Sb system which is considered as lead-free replacement for high-temperature applications.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Y. Yuan, G. Borzone, G. Zanicchi, S. Delsante,