High-strength and high-conductive Cu/Ag multilayer produced by ARB

In this research high-strength and high-conductive multilayered Cu/Ag composites were produced by accumulative roll bonding (ARB) process for the first time using Cu and Ag strips up to nine cycles. Electrical resistivity changes were measured by the four-point-probe method and tensile tests were performed to investigate the mechanical behavior of ARB products. Finally scanning and transmission electron microscopy (SEM and TEM) were used to study the microstructure of the layers.

Research highlights▶ By combining the two most conductive metals, Ag and Cu, a composite with extremely high electrical conductivity and high strength was produced be accumulative roll bonding method for the first time. ▶ UFG microstructures were observed in the Cu–Ag samples after five ARB cycles. ▶ The continuity of the constituent Cu and Ag layers was maintained up to the ninth cycle owing to the low hardness and high thickness ratio of the two constituent phases. ▶ The sample group with initial thicker silver layer (200 μm) had higher conductivity and strength from the nine cycle of ARB process compare to 100 μm silver layer.