Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1618764 | Journal of Alloys and Compounds | 2010 | 6 Pages |
Nanocrystalline Sn–3.5Ag–0.7Cu alloy powders were successfully fabricated by mechanical alloying (MA). During MA, Sn, Ag and Cu powders were deformed, overlapped and cold-welded together to form lamellar composites. The lamellar composites were then transformed into equiaxial particles. The milled powders were composed of a supersaturated solid solution, named Sn(Ag, Cu), and intermetallic compounds (IMCs) of Ag3Sn and Cu6Sn5. The average particle size (D4,3) and the melting point of the 60 h milled Sn–3.5Ag–0.7Cu powders were 19.9 μm, and 219 °C, respectively. After melting the powders on a Cu substrate at 260 °C, a dense solder was formed, consisting of a hypereutectic structure of oval shaped primary β-Sn and eutectic products of β-Sn, Cu6Sn5, and Ag3Sn. Meanwhile, the Ag3Sn laths at the solder/Cu6Sn5 layer interface and the coarse Cu6Sn5 plates in the solder were also detected.