Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1618929 | Journal of Alloys and Compounds | 2010 | 5 Pages |
Abstract
The microstructure and shape memory behavior of Ti44.6Ni40.1Cu15.3 thin films annealed at 773, 873, 973Â K for 1Â h were investigated. The Ti(Ni,Cu)2 particles precipitated in the grain boundaries and grain interiors. As the annealing temperature increased, the grain boundary precipitates became prominent. With increasing annealing temperature, the size of the precipitates increased while the density of precipitates decreased. Unexpected B19â² martensite formed in the annealed thin films, resulting from the composition variation in the matrix induced by precipitation process. Both of the maximum recoverable strain and the critical stress for slip decreased with increasing annealing temperature, which was mainly attributed to the coarsening of the Ti(Ni,Cu)2 precipitates.
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Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Z.Y. Gao, M. Sato, A. Ishida,