| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1621061 | Journal of Alloys and Compounds | 2009 | 7 Pages |
Abstract
Influence of indium in Sn3.13Ag0.74Cu solder containing 4, 15, 30, 50 and 75 at.% In on the microstructure at the solder/Cu interface after wetting at 523 K for 1800 s was studied. The scanning electron microscopy (SEM) combined with energy-dispersive X-ray spectroscopy (EDX), standard and spatially resolved X-ray diffraction (XRD) techniques were used to determine the phases present at the solder/Cu interface. It was found that for In concentration up to 30 at.% the interface is formed by Cu6Sn5 phase. For higher In content (50 and 75 at.% In) interface consists of copper rich Cu41Sn11 phase.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Pavol Šebo, Zbigniew Moser, Peter Švec, Dušan Janičkovič, Edmund Dobročka, Wladyslaw Gasior, Janus Pstruś,