Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1621916 | Journal of Alloys and Compounds | 2009 | 4 Pages |
Abstract
The reactions between Cu and the Sn2.5Ag0.8Cu solders doped with 0, 0.005, 0.01, 0.03, 0.06, or 0.1 wt.% Ni were studied. Reaction conditions included multiple reflows and solid-state aging at 160 °C. The Ni additions produced much thinner Cu3Sn layers for all the Ni concentrations used. Ni concentration higher than 0.01 wt.% could effectively retard the Cu3Sn growth even after 2000 h of aging, and accordingly 0.01 wt.% can be considered the minimum effective Ni addition.
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Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Y.W. Wang, C.C. Chang, C.R. Kao,