Synthesis of nickelocene containing polyimides with low-dielectric constants

Polyimides embedding the nickelocene unit were prepared by in situ curing of poly(amic acid) macromolecules with nickelocene, for the molecular-level design of low-dielectric constant (low-κ) materials. The effects of nickelocene on dielectric properties of polyimide are investigated in detail in this study. Nickelocene containing polyimides exhibit a number of desirable properties including low-water absorption and admirable thermal stability. Systematic studies demonstrate that proper insertion of nickelocene into a polyimide backbone can give rise to a reduction in the material's dielectric constant. All composites were subjected to DSC measurements for the purpose of examining microscopic miscibility. DSC thermograms of all composites showed only one Tg from all composition.