| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1623102 | Journal of Alloys and Compounds | 2009 | 5 Pages |
Abstract
Influence of Cr on growth of interfacial intermetallic compound (IMC) at the interface of Sn–9Zn/Cu substrate during aging at 85 °C/20%RH and 85 °C/85%RH for 500 h has been investigated. After aging treatment, IMC layer at the Sn–9Zn/Cu joint is much thicker than that at the Sn–9Zn–Cr/Cu joint. Estimation according to experimental data presents that IMC growth rate of Sn–9Zn–Cr/Cu interface is about 70–75% lower than that of Sn–9Zn/Cu interface.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Xi Chen, Anmin Hu, Ming Li, Dali Mao,