| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1623242 | Journal of Alloys and Compounds | 2009 | 6 Pages |
Abstract
Microstructures of Ag3Sn particles, formed around Cu6Sn5 intermetallic compound (IMC) and in a lead-free solder (Sn3.5Ag0.5Cu), changes significantly under thermal-shearing cycling condition. In the solder, the coarsening kinetic of Ag3Sn particles was studied, which was correlated with stress-strain rate of the solder joints subjected to thermal-shearing treatments. Furthermore, the large Ag3Sn platelets surrounding Cu6Sn5 had obvious effect on the morphology and growth of Cu6Sn5 IMC. Formation mechanism of Ag3Sn particles during thermal-shearing cycling process was investigated.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Lihua Qi, Jihua Huang, Xingke Zhao, Hua Zhang,