Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1623269 | Journal of Alloys and Compounds | 2009 | 6 Pages |
Abstract
The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy, using a Ni–Si–B interlayer, was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However, at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature, formation of borides in diffusion-affected zone is suppressed and the time required for isothermal solidification completion is increased.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
M. Pouranvari, A. Ekrami, A.H. Kokabi,