| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1624281 | Journal of Alloys and Compounds | 2008 | 5 Pages |
Abstract
Interfacial reactions between pure Sn and Co at different temperatures were investigated by using EPMA. Different intermetallic compounds were detected in the reaction couples. CoSn2 was formed at 673 and 773 K while CoSn appeared at 873 K in the Sn/Co couples. In order to illuminate the formation mechanism of the intermetallic compounds, the driving force of nucleation, relative stability and Co diffusion through the interface have been taken into account. Consequently, the formation of intermetallic compounds through interfacial reactions has been explained.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
WenJun Zhu, HuaShan Liu, Jiang Wang, ZhanPeng Jin,