Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1624968 | Journal of Alloys and Compounds | 2008 | 5 Pages |
Abstract
The microstructure of Sn96.4Ag2.8Cu0.8 (at.%) solder alloy when rapidly quenched onto an Au surface finish has been found to range from nanometer to micrometer-sized features. This striking microstructure contained a spectrum of phases from the Au-Sn phase diagram, while Ag and Cu did not appear to participate in the solidification process. Within the solder contact, a eutectic with 40Â nm interlamellar spacing was observed, along with the presence of layered intermetallics. Observations of these phases and their orientation offer better understanding of the solidification of Pb-free solders onto Au.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
R. Bali, E. Fleury, S.H. Han, J.P. Ahn,