Article ID Journal Published Year Pages File Type
1625490 Journal of Alloys and Compounds 2008 5 Pages PDF
Abstract
Influences of fabrication processes on electrochemical properties of Si thin film electrodes were investigated by utilizing a Ni buffer layer and annealing the fabricated films. Electrochemical properties of four Si film electrodes (Si/Cu, annealed Si/Cu, Si/Ni/Cu and annealed Si/Ni/Cu) fabricated with different processes were evaluated. Si electrode films fabricated on Cu substrate and Ni film were amorphous and their structures are still maintained after annealing. Fine Ni clusters with a trigonal shape were observed in the Ni/Cu film and coalesced after annealing. The highest capacity efficiency can be obtained from the Li/Si cell with the annealed Si/Ni/Cu film. The insertion of the Ni film as a buffer film and the post-annealing enhanced adhesion between Si film and Cu substrate.
Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
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