Article ID Journal Published Year Pages File Type
1627026 Journal of Alloys and Compounds 2007 12 Pages PDF
Abstract

This study investigates the influence of aging treatment on deformation behavior of 96.5Sn3.5Ag eutectic solder alloys with lower strain rate (<10−3 s−1) during tensile tests under the scanning electron microscope. Results showed that because of the existence of Ag3Sn intermetallic particles and the special microstructure of β-Sn phases in Sn3.5Ag solder, grain boundary sliding was not the dominant mechanism any longer for this Pb-free solder. While the interaction of dislocations with the relatively rigid Ag3Sn particles began to dominate. For the as-cast specimen, accompanied by partial intragranular cracks, intergranular fracture along the grain boundaries in Sn–Ag eutectic structure or the interphase boundaries between Sn-rich dendrites and Sn–Ag eutectic phases occurred primarily in early tensile stage. However, the boundary behavior was limited by the large Ag3Sn particles presented along the Sn-rich dendrites boundaries after aging. Plastic flow was observed in large area, and cracks propagated in a transgranular manner across the Sn-dendrites and Sn–Ag eutectic structure.

Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
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