| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1630676 | Journal of University of Science and Technology Beijing, Mineral, Metallurgy, Material | 2006 | 5 Pages |
Abstract
An experimental study on the microstructures of a rapid directionally solidified metallo-eutectic Sn-Cu alloy was carried out. This material is an important alloy that is used as a lead-free solder. The results showed that the kinetic undercooling due to the rapid solidification process led to the formation of a pseudoeutectic zone, whereas the hypereutectic reaction produced the regular lamellar structure in the hypereutectic Sn-1.0Cu alloy. The corresponding arm spacing in the obtained lamellar phases decreased gradually with the increase of the applied cooling rate, which corresponded well with the prediction of a rapid directional solidification model.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Jun Shen, Yongchang Liu, Houxiu Gao,