Experimental Investigation of Micro-sized Aluminium Oxide Reinforced Epoxy Composites for Microelectronic Applications

The present work aims at developing a class of particulate filled polymer composites consisting of epoxy as base matrix reinforced with micro-sized aluminium oxide (Al2O3) particles. A set of composites, with Al2O3 content ranging from 0 to 25 vol% have been fabricated by hand lay-up technique. Density (ρc), effective thermal conductivity (keff), glass transition temperature (Tg), coefficient of thermal expansion (CTE) and dielectric constant (ɛc) of these composites are measured experimentally. The measure values of keff are then compared with the values obtained from few established theoretical model and with the values calculated using the mathematical correlation developed by the authors. It is seen that the values obtained from the correlation developed by the authors fit well with measured conductivity values. Inclusion of Al2O3 in resin increases the keff and Tg whereas CTE of composite decreases favourably. The dielectric constant of the composite also found to get modified with filler content.