Deformation behavior of dispersion-strengthened copper at high temperature

The deformation behavior of dispersion-strengthened copper with different compositions was investigated by hot compression simulation tests on a Gleeble-1500 thermal-mechanical simulator. The microstructure during deformation at high temperature was also studied. The result shows that at the beginning of hot compression simulation, the flowing stress of the dispersion-strengthened copper quickly attains a peak value and the stress shows a greater decrease when the temperature is higher and the strain rate is lower. The dispersion particles lead to an obvious increase in the recrystallization temperature. Under experimental conditions, dynamic recovery is the main softening method. The constitutive equation at high temperature of 1.2%Al2O3-0.4%WC/Cu is obtained.